MeshConnect? Sub-G Module Series
TABLEOFCONTENTS
Introduction and Overview
Description ..............................................................................................................................................................................................
Features ..................................................................................................................................................................................................
Applications ............................................................................................................................................................................................
Ordering Information .............................................................................................................................................................................
Module Block Diagram ...........................................................................................................................................................................
Development Kit .....................................................................................................................................................................................
System Level Function
Transceiver IC .........................................................................................................................................................................................
Antenna ...................................................................................................................................................................................................
Additional Flash Memory .......................................................................................................................................................................
Electrical Specification
Absolute Maximum Ratings ...................................................................................................................................................................
Recommended (Operating Condition) ..................................................................................................................................................
DC Characteristics ..................................................................................................................................................................................
RF Characteristics ..................................................................................................................................................................................
Pin Signal & Interfaces
Pin Signals I/O Configuration ................................................................................................................................................................
I/O Pin Assignment .................................................................................................................................................................................
Software/Firmware ..................................................................................................................................................................................
Module Dimensions ................................................................................................................................................................................
Module Footprint ....................................................................................................................................................................................
Processing .........................................................................................................................................................................................
Agency Certifications ...................................................................................................................................................................
Shipment, Storage & Handling .................................................................................................................................................
Quality ..................................................................................................................................................................................................
References & Revision History .................................................................................................................................................
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相关代理商/技术参数
ZICM0900P2-1C-B 功能描述:射频模块 900MHZ W/WIRE ANT. -40C +85C 3.3VOLT RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm
ZICM0900P2-1C-SN 功能描述:射频模块 900MHZ W/WIRE ANT. -40C +85C 3.3VOLT RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm
ZICM0900P2-1C-SN-B 功能描述:射频模块 900MHZ W/WIRE ANT. -40C +85C 3.3VOLT RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm
ZICM0900P2-1CU 功能描述:射频模块 900MHZ U.FL CONN. -40C +85C 3.3VOLT RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm
ZICM0900P2-1CU-B 功能描述:射频模块 900MHZ U.FL CONN. -40C +85C 3.3VOLT RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm
ZICM0900P2-1CU-SN 功能描述:射频模块 900MHZ U.FL CONN. -40C +85C 3.3VOLT RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm
ZICM0900P2-1CU-SN-B 功能描述:射频模块 900MHZ U.FL CONN. -40C +85C 3.3VOLT RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm
ZICM0900P2-KIT1-1 功能描述:射频开发工具 900MHZ EVAL BOARD -40C +85C 3.3VOLT RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V